DUSTERATECH is an IC Design Service company headquartered in Shanghai. We support chip design companies, system vendors and high-end IC development teams with analog layout, physical design, ASIC turnkey coordination and wafer shuttle services.
DUSTERATECH was founded in 2022 and is headquartered in Shanghai. The team focuses on IC layout design services and professional consulting.
Our capability spans 350nm-22nm CMOS nodes and 16nm-5nm FinFET advanced-node physical design, with emphasis on high-end programs at 28nm and below.
We focus on short-range RF technologies such as WiFi and Bluetooth, serving consumer electronics and IoT applications.
DUSTERATECH organizes service scope around engineering delivery, from layout implementation and physical design to ASIC coordination and wafer shuttle interfaces.
Professional layout support for RF, analog and mixed-signal blocks where matching, parasitics, noise and reliability matter.
Advanced-node physical implementation support for high-end IC programs at 28nm and below.
Program-level support for ASIC customization, design coordination, manufacturing interface and delivery management.
Support for MPW and shuttle projects, including manufacturing interface, tapeout package checks and engineering follow-up.
Each stage aligns constraints, risks and deliverables before the project moves forward.
Chip type, process node, scope, existing data and confidentiality requirements.
Constraints, risks, resources and staged deliverables.
Layout, physical design, ASIC coordination or tapeout interface work.
Rule, timing, reliability, parasitic and delivery-quality closure.
Engineering data delivery, tapeout support and follow-up communication.
Please include chip type, process node, module scope, project phase, target tapeout time and available design materials.
